Why is Immersion Tin the Future of PCB Manufacturing?
In this article, we will take a closer look at why ISn is the future of PCB manufacturing and how it will transform the PCB industry.
What is ISn?
ISn is a process in which a PCB is dipped into a chemical bath containing a tin immersion bath. The copper surface reacts with the chemical bath forming a thin layer of tin on the surface of the copper substrate.
Benefits of ISn:
1. Legibility.
When compared to other traditional surface finishes like Electroless Nickel Immersion Gold (ENIG), ISn exhibits a much more uniform surface finish. The reflective and smooth surface of ISn makes it easier for machine vision systems to read dense population components accurately. This characteristic results in better quality inspection and testing of Printed Circuit Boards.
2. Solderability.
ISn also offers high solderability in both Pb-free and Pb-containing solders, which makes it an efficient and versatile option. The solderability of ISn assists in reducing the number of rejects in production and the rework required.
3. Corrosion Resistance.
ISn has an excellent corrosion resistance ability. Since the copper on PCBs has excellent electrical conductivity properties, it is readily oxidised in the presence of air or water molecules. This environmental degradation may become problematic, and the PCB may become unusable in extreme cases. However, the thin layer of tin provided by the ISn process protects the board from corrosion and improves its overall shelf life.
4. RoHS Compliance.
ISn is also RoHS (Restriction of Hazardous Substances) compliant. This compliance means that the immersion tin process does not contain any hazardous heavy metals or chemicals that pose a risk to the environment or human health. RoHS compliance is mandatory for all companies dealing with electronic manufacturing.
5. High-Speed Capability.
ISn technology is also capable of meeting the high-speed requirements of modern PCB designs. This is possible due to the ability of tin to act as a barrier against the migration of dissolved copper atoms from the copper substrate, thereby reducing signal loss and wave reflection. This improved signal integrity leads to a cleaner signal on the board, giving rise to improved performance.
Conclusion.
ISn technology is rapidly becoming the future of PCB manufacturing due to its ability to overcome the current limitations and constraints in traditional technologies. ISn technology creates PCBs that are both functional and effective, ensuring that a PCB's shelf life is significantly increased. ISn technology provides a uniform surface finish, has high solderability to both Pb-free and Pb-containing solders, is RoHS compliant, exhibits high corrosion resistance, and is capable of meeting high-speed requirements. .
ISn technology is rapidly becoming the preferred choice of PCB manufacturers due to its excellent advantages and cost-saving potentials, which ultimately leads to customer satisfaction through high-quality PCB products.
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